New Material Heat Sink
Structure:Dimensions (mm×mm): ≤100×100，Thickness (mm): ≥0.2
Specifications:WD120: Through-plane thermal conductivity Kz＞120W/(m·K)，WD090: Through-plane thermal conductivity Kz＞90W/(m·K)
Advantages: High reliability, high thermal conductivity, low density and high compressibility. Widely applied for chip heat dissipation in AI data centers, power control systems, UAVs & satellites, automotive autonomous driving, humanoid robots and other fields.